Realme GT Neo 3, some images and different specifications thanks to TENAA

Some more information has leaked about Realme GT Neo 3, after just the day before yesterday we saw the first render thanks to the tireless OnLeaks. This time it is TENAA, the Chinese certification body equivalent to the American FCC, which adds some useful elements to make the device identikit more defined. There are also some images, but between the resolution and the angle they don’t add much to what we already knew.

As we know, Realme GT Neo 3 will have a triple rear camera contained in a rectangular module positioned at the top left. The back side, apart from the Realme logo, as usual vertically and positioned at the bottom left, remains perfectly clean, leaving room for the dark gray knurled glass finish. The photo alongside allows us to observe that the camera module will protrude from the main body, but not by a lot – just a few millimeters.

As always, the front photos from this source remain absolutely useless for the purpose of stealing concrete information on the device. In any case, we can also observe that there will be two physical keys on one side, and one on the other. It is probably about volume and power, respectively. In the shared rendering the day before yesterday, the writing on the camera module confirmed that the main camera will have optical stabilization and that resolution will be 50 MPbut in today’s photos you can’t see it – and it doesn’t just seem a matter of poor image resolution.

The technical specifications that emerged are the following:

  • Code names: RMX3560 and RMX3562
  • Display: 6.7 “, AMOLED, FHD + resolution, central hole for the camera, integrated fingerprint scanner
  • RAM: 8 or 12 GB
  • Internal storage: 128, 256 or 512 GB
  • Cameras:
    • Rear wide angle (main): 50 MP
    • Ultra Wide Rear: 8 MP
    • Auxiliary rear: 2 MP
    • Front: 16 MP
  • Battery: 2,180 mAh (probably means that it is a dual cell, with total capacity around 4,500 mAh)
  • Dimensions: 163.3 x 75.6 x 8.2mm
  • Weight: 188 g

22 Feb

The SoC still remains to be clarified. Earlier rumors pointed to Qualcomm’s Snapdragon 888, but the Dimensity 8100 hypothesis has recently popped up and is expected to be unveiled next month. The smartphone, however, is still quite distant: the Chinese brand has already confirmed that it will be announced even at the end of July, at least in India.